替代专业:Relevant technical disciplines such as Materials Science or Industrial Engineering
可替代教育及经验组合:N
所需教育层级:
其他可替代教育层级:
认可经验年限:
境外教育背景:Y
可替代职业:Y
可替代职业时长（月）:12
可替代职业名称:Any occupation or position with skills listed in H14
是否为正常职业要求:N
是否需要外语:N
特殊技能:One year of academic, research, andor industry experience performing mechanical simulations on IC packages using commercially available FEM tools such as ANSYS, ABAQUS, Hypermesh, etc.; performing characterization and failure analysis of various types of IC packages to facilitate product development; developing methods and processes to study physical, chemical as well as dielectric properties of epoxy molding compounds using techniques such as dielectric analysis, FT IR and NMR to facilitate with material selection for particular IC packaging applications; using failure analysis tools such as Xray, EDS, SEM, optical microscopes, etc. for root cause analysis and FMEA to understand package reliability concerns; working closely with cross functional teams to understand packaging needs, identify customer requirements, and resolve complex problems. Must have solid oral, written, and presentation communication skills to efficiently communicate across a global organization where success is highly dependent on collaboration and effective communication.